 |
|
|
|
|
|
深圳市韩城电子科技有限公司
地 址: 深圳市宝安26区前进路创业广场大厦1108室
电 话:0755-27831615
27824302
传 真:0755-27831706
联系人: 余生
手 机: 13602584438
在线QQ: 330479931
在线MSN:
msn客服
E-mail:hancheng@honshing.com
网 址:http://www.honshing.com |
| |
|
|
|
| |
|
|
|
无铅回流焊
 |

 |
 |
● 上炉体可整体开启,采用双电动丝杆顶升机构,安全可靠,便于
炉膛清洁。
● 独特高效加热风道,大幅度提高热空气循环流量,升温迅速,
热补偿效率高,可进行高温焊接及固化。
● Tailor – made rails to keep no deformation in long-terms.
● Mesh & rail peep the same pace, equipped with high
quality timing motor, closed-koop controlled by computer, running
stably. |
 |
 |
● 网链等速运输,配以进口调束马厉害,电脑全闭环控制,运
行平稳。导轨调宽采用调速马达,面板控制,简便易用。
● Adopted timing motor to adjust the width of rails, which
is controlled by operation panel. |
 |
 |
● PLC + 模块化控制,性能稳定。
● 设有漏电保护装置,确保操作人员及设备的安全。双温度监
测系统在超高温时,自动切断加热电源。
● PCL + Modularization control to assure the reliability & stability.
●
Dual temperature sensor and dual security control sys-
tem, the temperature monitoring system which is not
appurtenant to the main control system enable to switch
off heating power automatically while oven is reach abnormal high temperature.
|
 |
 |
● 软件管理SS系列控制程序采用Windows XP系统,控制界
面图文丰富,操作简便;
●
操作方便,界面友好并可中、英、日文随进切换;
● User friendly Windows XP , easy to operate.
●
Multi-language edition can be exchanged on line
(Chinese, English and Japanese) |
 |
 |
● 图中A代表在焊锡熔化前(217℃)每一个温度点达到了
均一,从而实现了高效的回流焊接。
●
图中B代表热风温度,我们可以看到每个温区有独立的温
度且相互无干扰,因为每个温区的温度已经达到相对均匀
● 图中C代表在设定值和实测值之间有一个小的温度差值,
它表明热量被最大限度地传送到了PCB板。
● A indicate-The temperature of every point reached to
uniformity before solder melting (217℃),which can
better accomplish high efficiency reflow soldering.
● B indicate-Air temperature, we can see that every zone have individual temp and no disturbance since the
heating zone temp was achieved to uniformity.
● C indicate-There is a small temperature gap between setting and real measurement that showed the heat volume had been transferred to PCB ultimately. |
 |
 |
● 中央支撑系统:独特的中央支撑,可承托多联板,不影
响温区及PCB板温度;加装中央支撑装置时PCB最小宽
度:70mm.
● Center support System: Unique center support system
to make the multiple panels on deforming, do not
influence the temperature of heating zone and PCB. The width of? PCB is not less than 70mm while installing the center support system.. |
 |
 |
● 强制冷却系统实现急冷达到无铅焊接工艺的冷却降温要
求。
● Forced convection cooling system to easily reach the
requirements of strict lead free soldering processes. |
 |
 |
● 新的风道管理装置使加热效率提高了10%并减小了
△T排风含过滤装置,清洗方便
● The heating efficiency was improved by 10% through adopting new air management system to get smaller
△T;
the forced exhaust system with filters which is
easy to
be cleaned. |
 |
 |
●
增加有效对流区与总加热区的长度比例,大大地提高了
加热效率及均匀性;
● 采用独立温控和风速可调设计,可满足高精度的焊接工
艺要求;
● Lengthening the each heating zone and minimize the space between each zone so that significantly improve
the uniformity and efficiency of? heating.
● Temperature controlling independently & air velocity
adjustable to meet high-precision
soldering requirements. |
| |
|
|
|