● 步进马达驱动助焊剂喷雾系统，喷雾速度自动随PCB宽度及 运输速度进行调节，确保任何时候喷雾的均匀性。 ● Motorized flux spray unit: spray nozzle is driven by
servomotor. The nozzle speed can be changed according
to
the PCB width and conveyor speed. Uniform flux application is guaranteed.
● 微热风循环加热，温度控制准确，三段式加长预热区
1800mm，温度独立控制，可做保温温度平台，微热风可调 ● “Slight Hot air current circulation” for three
Lengthen—edpreheating zone totaling 1800mm which is
control—olled independently and accurately. The slight
hot current is adjustable.
● 温度补偿系统：满足无铅焊接中的高温要求，经补偿后，
PCB在进入锡炉前温度下降范围2℃，减小热冲击。 ● The quantity of heat compensatory unit for preheating: satisfy the high temperature demand in lead—free
Soldering, guarantee the declined range of temperatures
from within 2℃。
● 防腐蚀钛合金炉胆：适用无铅工艺，寿命长。（先配项） ● Titanium alloy solder bath: suitable for lead – free solder.
● 锡炉进出及升降均采用马达驱动系统：配备多个传感器互锁
装置，防止误操作损伤机器。 ● Motorized mechanism for solder bath: The electric lifters
can raise/lowers the soldering bath for easy maintenance.
The bath can also be automatically。
● PCB急冷却系统：出口冷气温度可达10℃以下，可明显改
善无铅焊料共晶生成时产生的空泡及焊盘剥离问题。同时具
有助焊剂回收功能。（选配项） ● Cooling system: with the cooling speed of 10℃/s or higher, fillet lifting effect on through – hope PCB can be
reduced greatly and rough – hole PCB can be reduced
greatly and rough surface on solder joint in slow cooling
can also be eliminated。
● PLC + 模块化控制，性能稳定。 ● PLC + Modularization control to assure the reliability &
stability.
● 控制程序： ● 控制程序采用Windows XP 系统，控制界面图文丰富， 操作简便； ● 操作方便，界面友好并可在中、英、日文之间随时切换 ● User friendly Windows XP, easy to operate. b. Multi – language edition can be exchanged on line (Chinese, English, and Japanese)
● 快速调用存贮的参数，工作参数数值设定，工艺一至性好， 自动记录设备一年的生产工作状况。 ● The friendly PC program permits a complete visualization and documentation of all-important solder parameters. Themachine of twelve months.
大创-CB-354无铅波峰焊
